Electronic Components Powder Pressing Machine Model CIP produced by OPPC (Japan) is designed for electronic components automatic molding of printed circuit board (PCB) surface-mount technology (SMT), including inductors with powder ferrite cores, etc.

The unit provides an automatic molding of electronic components from metal powders. The exact configuration of the parts is set using software by adjusting punches drive servomotor force. Software setup properties help to achieve a very high pressing precision while maintaining high performance. Bunker automatic backfilling and pressing process management provides a powder material savings. Custom made additional mold sets ensure parts various sizes and configurations. Fully automated workflow simplifies maintenance and operation.

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